Reported in published customer studies using automated SmartDO optimization workflows.
SmartDO Semiconductor Applications
70%
Iteration Time Reduction
Higher
Packaging Reliability
Better
Material Correlation
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Semiconductor Packaging, Material Fitting and Optimization
SmartDO is used by semiconductor manufacturers to improve packaging design, material characterization, manufacturing yield and product reliability through automated engineering optimization.
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Published customer studies report that SmartDO can reduce computational
iteration time by up to 70% while producing improved design results.
Package Reliability
Material Fitting
Thermo-Mechanical Analysis
Yield Optimization
Optimization can reduce critical stress, deformation and failure risk in package structures.
Material parameters can be fitted to experimental or simulation response data.
Technical Application Areas
SmartDO supports the optimization of package geometry, process parameters and material properties across semiconductor design and manufacturing workflows.
01
Packaging Yield Optimization
Improve process windows and reduce package defects by optimizing key design and manufacturing variables.
02
Reliability Assessment
Minimize thermo-mechanical stress, warpage, delamination risk and fatigue-related failure.
03
Material Property Fitting
Identify material constants by matching analytical or simulation results with measured data.
04
Multi-Physics Optimization
Evaluate thermal, structural and process-related performance within one optimization framework.
Typical Optimization Workflow
SmartDO can automate the connection between design variables, numerical solvers, experimental data and engineering constraints.
Define Design and Material Variables
Specify package dimensions, layer thicknesses, process parameters and material constants.
Connect Simulation or Test Data
Link thermal, structural or manufacturing simulation results with measured performance data.
Apply Reliability Constraints
Control warpage, stress, temperature, strain, fatigue life and package quality requirements.
Search for the Best Design
SmartDO evaluates candidate combinations and identifies improved package and material configurations.
Discuss Your Semiconductor Optimization Requirement
Contact our engineering team to explore SmartDO applications for semiconductor packaging, reliability and material property optimization.